(Wire  cutting and grinding disc Electrical Discharge Machining referred WEDM), an electrical processing areas by the former Soviet Union Raza Linke couple created and invented the electric spark processing methods. EDM also invented in 1960 in the former Soviet Union, the country is the first one for the industrial production of the country. The basic physical principles of free positive ions and electrons present in the accumulation , and soon to be ionized to form a conductive path . At this stage, a current between the two plates . Causes numerous collisions between particles occurs , to form a plasma , and soon raised to 8000-12000 degrees Celsius , the two conductor surface instantly melt some materials , and because the electrode and the dielectric liquid is vaporized to form a bubble , rules and its rise until the pressure is very high . Then current is interrupted , the temperature suddenly reduced, causing air bubble implosion , the power generated to melt the material thrown cutting and grinding disc  the crater , and then etching the dielectric material of condensed liquid back into small spheres, dielectric fluid was discharged . Then through the NC-controlled monitoring and control, servo implementation, so that uniform discharge phenomenon .

1, the plating process is simple, less investment, ease of manufacture;
2, without dressing, easy to use;
3, single-layer structure determines it can reach very high operating speed, the current foreign countries have been as high as 250 ~ 300m / s;
4, although only a single layer of  cutting and grinding disc , but there is still sufficient lifetime;
5, for high precision roller wheels, electroplated unique manufacturing method.  Precisely because of these advantages, plating wheel speed, ultra-high speed grinding occupy undisputed dominance.
 Electroplated grinding wheel is produced electrochemically diamond wheel. Working layer contains a diamond abrasive wheel, metal bond diamond abrasive is bonded to the substrate.
1, the thickness of the deposited metal bond cutting and grinding disc  abrasive grains is 20% of the height (the sand);
2, continue to use the metal bond diamond abrasive grains bonded (thickened), grain height thickness of about 2/3.
3, diamond dressing wheel, grinding or cutting with a diamond wheel.